Electronic packaging and interconnection handbook.
Material type: TextPublication details: London : McGraw-Hill, 1996.Edition: 2nd edISBN:- 0070266948
- 621.381046 20
Item type | Home library | Call number | Status | Date due | Barcode | Item holds | |
---|---|---|---|---|---|---|---|
Not For Loan | College Lane Learning Resources Centre Main Shelves | 621.381046 HAR (Browse shelf(Opens below)) | Not for loan | 4403745067 |
Enhanced descriptions from Syndetics:
Electronic Packaging Defined -- Ch. 1. Materials for Electronic Packaging -- Ch. 2. Thermal Management -- Ch. 3. Connector and Interconnection Technology -- Ch. 4. Wiring and Cabling for Electronic Packaging -- Ch. 5. Solder Technologies for Electronic Packaging -- Ch. 6. Packaging and Interconnection of Integrated Circuits -- Ch. 7. The Hybrid Microelectronics Technology -- Ch. 8. Rigid and Flexible Printed Wiring Boards -- Ch. 9. Surface Mount Technology -- Ch. 10. Advanced Electronic Packaging -- Ch. 11. Packaging of High-Speed and Microwave Electronic Systems -- Ch. 12. Packaging of High-Voltage Systems -- Appendix. Some Acronyms and Symbols for Electronic Packaging and Interconnecting.