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Electronic packaging and interconnection handbook.

By: Material type: TextTextPublication details: London : McGraw-Hill, 1996.Edition: 2nd edISBN:
  • 0070266948
Subject(s): DDC classification:
  • 621.381046 20
Contents:
Electronic Packaging Defined -- Ch. 1. Materials for Electronic Packaging -- Ch. 2. Thermal Management -- Ch. 3. Connector and Interconnection Technology -- Ch. 4. Wiring and Cabling for Electronic Packaging -- Ch. 5. Solder Technologies for Electronic Packaging -- Ch. 6. Packaging and Interconnection of Integrated Circuits -- Ch. 7. The Hybrid Microelectronics Technology -- Ch. 8. Rigid and Flexible Printed Wiring Boards -- Ch. 9. Surface Mount Technology -- Ch. 10. Advanced Electronic Packaging -- Ch. 11. Packaging of High-Speed and Microwave Electronic Systems -- Ch. 12. Packaging of High-Voltage Systems -- Appendix. Some Acronyms and Symbols for Electronic Packaging and Interconnecting.
Holdings
Item type Home library Call number Status Date due Barcode Item holds
Not For Loan Not For Loan College Lane Learning Resources Centre Main Shelves 621.381046 HAR (Browse shelf(Opens below)) Not for loan 4403745067
Total holds: 0

Enhanced descriptions from Syndetics:

Electronic Packaging Defined -- Ch. 1. Materials for Electronic Packaging -- Ch. 2. Thermal Management -- Ch. 3. Connector and Interconnection Technology -- Ch. 4. Wiring and Cabling for Electronic Packaging -- Ch. 5. Solder Technologies for Electronic Packaging -- Ch. 6. Packaging and Interconnection of Integrated Circuits -- Ch. 7. The Hybrid Microelectronics Technology -- Ch. 8. Rigid and Flexible Printed Wiring Boards -- Ch. 9. Surface Mount Technology -- Ch. 10. Advanced Electronic Packaging -- Ch. 11. Packaging of High-Speed and Microwave Electronic Systems -- Ch. 12. Packaging of High-Voltage Systems -- Appendix. Some Acronyms and Symbols for Electronic Packaging and Interconnecting.